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Posted August 09, 2026

Technical Program Manager

Diamond Foundry
Bodega Bay, CA, US Full Time
170000USD - 230000USD per year

Job Description

Job Description
Diamond Foundry is seeking an experienced Technical Program Manager to lead strategic customer-facing technology development programs for our advanced single-crystal solutions. This role serves as the bridge between engineering, customers, and business teams, driving complex technical programs from concept through product introduction.
The ideal candidate has a strong technical foundation in semiconductor materials and packaging, outstanding communication skills, and a proven ability to drive execution. They are a proactive leader who can build customer relationships, align cross-functional teams, and deliver results in a fast-paced environment.
Responsibilities:

  • Lead customer-facing technical development programs from kickoff through successful execution.

  • Serve as the primary interface between customers and internal engineering teams, communicating technical concepts clearly and managing expectations.

  • Drive cross-functional program execution by coordinating engineering, product, manufacturing, and business teams to achieve technical, business, and schedule objectives.

  • Lead technical reviews, customer meetings, and executive program updates while proactively identifying risks and driving timely resolution of issues.

  • Support New Product Introduction (NPI) activities, including project planning, design reviews, customer deliverables, and schedule management.
  • Represent Diamond Foundry's single-crystal diamond technology and advanced packaging capabilities to customers and strategic partners.
Qualifications

  • Advanced degree in Materials Science, Materials Engineering, Chemical Engineering, or a related engineering discipline; MBA is a plus.

  • 5+ years of experience in semiconductor manufacturing, wafer fabrication, advanced packaging, or related technologies.

  • Strong understanding of semiconductor materials, wafer fabrication, device packaging, and bonding technologies.

  • Proven customer-facing experience with the ability to communicate complex technical concepts clearly and professionally.

  • Exceptional communication, organizational, and program management skills with a demonstrated ability to drive results and meet aggressive deadlines.
  • Experience working with semiconductor packaging suppliers and the broader semiconductor ecosystem is highly desirable.

We may use artificial intelligence (AI) tools to support parts of the hiring process, such as reviewing applications, analyzing resumes, or assessing responses and identifying potential inconsistencies or verification signals in application materials based on available information. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.

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